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| INTEGRATED CIRCUITS PDIUSBD11 USB device with serial interface Product specification Supersedes data of 1999 Nov 19 1999 Jul 22 Philips Semiconductors Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 FEATURES * Complies with the Universal Serial Bus specification Rev. 1.1 * Complies with the ACPI, OnNOW, and USB power management requirements DESCRIPTION The Universal Serial Bus hub PDIUSBD11 is a cost and feature-optimized USB interface device. It is used in microcontroller-based systems and communicates with the system microcontroller over the high speed I2C serial bus. This modular approach to implementing USB functions allows the designer to choose the optimum system microcontroller from the available wide variety. This flexibility cuts down the development time, risks, and costs by allowing the use of the existing architecture and the firmware investments. This results in the fastest way to develop the most cost-effective USB peripheral solutions. The PDIUSBD11 is ideally suited for computer monitors, docking stations, keyboards, and many other applications that use the I2C or the SMBus-based architecture. The PDIUSBD11 conforms to the USB specification Rev. 1.1, I2C serial interface and the SMBus specifications. It is fully compliant with the Human Interface Device Class and Monitor Control Class specifications. Its low suspend power consumption along with the programmable LazyClock output allows for easy implementation of equipment that is compliant to the ACPI, OnNOW, and USB power management requirements. The low operating power allows the implementation of bus-powered function. The PDIUSBD11 is fully backward compatible to the PDIUSBH11/PDIUSBH11A software. In addition, it also incorporates the feature enhancements like SoftConnectTM, LazyClock, programmable clock output, lower frequency crystal oscillator, multiple function endpoints and integration of termination resistors. All of these feature enhancements contribute to significant cost savings in the system implementation and at the same time ease the implementation of advanced USB functionality into the peripherals. * Compliant with USB Human Interface Devices and Monitor Control Class * Compliant with System Management Bus Specification Rev. 1.0 * Integrated SIE (Serial Interface Engine), FIFO memory and transceivers * Automatic USB protocol handling * High speed I2C Interface (up to 1 Mbit/s) * Compatible with the PDIUSBH11 software * Software controllable connection to USB bus (SoftConnectTM) * Low frequency 12 MHz crystal oscillator eases EMI design issues * Programmable output clock frequency * Bus powered capability with very low suspend current * Controllable LazyClock output during suspend * Single 3.3 V supply with 5 V tolerant I/O * Available in 16-pin DIP and SO packages * Full-scan design with high fault coverage (>99%) insures high quality * Higher than 8 kV in-circuit ESD protection lowers cost of extra components ORDERING INFORMATION PACKAGES 16-pin plastic SO 16-pin plastic DIP TEMPERATURE RANGE -40C to +85C -40C to +85C OUTSIDE NORTH AMERICA PDIUSBD11 D PDIUSBD11 N NORTH AMERICA PDIUSBD11 D PDIUSBD11 N PKG. DWG. # SOT162-1 SOT38-4 BLOCK DIAGRAM 12 MHz UPSTREAM PORT D+ 1.5kW D+ SoftConnectTM ANALOG TX/RX FULL SPEED 3.3V D- PLL INTEGRATED RAM BIT CLOCK RECOVERY INTERRUPT PHILIPS SIE MEMORY MANAGEMENT UNIT I2C SLAVE INTERFACE SDA SCL SV00823 NOTE: 1. This is a conceptual block diagram and does not include each individual signal. 1999 Jul 22 2 853-2050 22023 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 Analog Transceiver The transceiver interfaces directly to the USB cables through some termination resistors. They are capable of transmitting and receiving serial data at "full speed" (12 Mbit/s) only. I2C Slave Interface This block implements the necessary I2C interface protocol. A slave I2C allows for simple micro-coding. An interrupt is used to alert the microcontroller whenever the PDIUSBD11 needs attention. As a slave I2C device, the PDIUSBD11 I2C clock: SCL is an input and is controlled by the microcontroller. The I2C interface can run up to 1 Mbit/s. PLL A 12 MHz to 48 MHz clock multiplier PLL (Phase-Locked Loop) is integrated on-chip. This allows for the use of low-cost 12 MHz crystal. EMI is also minimized due to lower frequency crystal. No external components are needed for the operation of the PLL. SoftConnectTM The connection to the USB is accomplished by bringing D+ (for high-speed USB device) high through a 1.5 kW pull-up resistor. In the PDIUSBD11, the 1.5 kW pull-up resistor is integrated on-chip and is not connected to VCC by default. The connection of the internal resistor to Vcc is established through a command sent by the external/system microcontroller. This allows the system microcontroller to complete its initialization sequence before deciding to establish connection to the USB. Re-initialization of the USB bus connection can also be affected without requiring the pull out of the cable. The PDIUSBD11 will check for USB VBUS availability before the connection can be established. VBUS sensing is provided through VBUS pin. It should be noted that the tolerance of the internal resistors is higher (30%) than that specified by the USB specification (5%). However, the overall VSE voltage specification for the connection can still be met with good margin. The decision to make sure of this feature lies with the users. SoftConnectTM is a patent pending technology from Philips Semiconductors. Bit Clock Recovery The bit clock recovery circuit recovers the clock from the incoming USB data stream using 4X over-sampling principle. It is able to track jitter and frequency drift specified by the USB specification. Philips Serial Interface Engine (PSIE) The Philips SIE implements the full USB protocol layer. It is completely hardwired for speed and needs no firmware intervention. The functions of this block include: synchronization pattern recognition, parallel/serial conversion, bit stuffing/de-stuffing, CRC checking/generation, PID verification/generation, address recognition, handshake evaluation/generation. Memory Management Unit (MMU) and Integrated RAM The MMU and the integrated RAM is used to handle the large difference in data rate between USB, running in bursts of 12 Mbit/s and the I2C interface to the microcontroller, running at up to 1 Mbit/s. This allows the microcontroller to read and write USB packets at its own speed through I2C. ENDPOINT DESCRIPTIONS ENDPOINT# ENDPOINT INDEX 2 3 5 4 6 7 8 9 TRANSFER TYPE DIRECTION OUT IN OUT IN OUT IN OUT IN MAX PACKET SIZE (BYTES) 8 8 8 8 8 8 8 8 0 1 2 3 Control Generic Generic Generic NOTE: 1. Generic endpoint can be used for Interrupt or Bulk endpoint. 1999 Jul 22 3 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 PIN DESCRIPTION PIN NO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PIN SYMBOL TEST RESET_N XTAL1 XTAL2 CLKOUT VCC SUSPEND INT_N SDA SCL GND DP DM AGND AVCC VBUS TYPE Input Input Input Output Output Power Output Output I/O I/O Power AI/O AI/O Power Power Input OD6 OD6 OD6 OD6 3 mA ST DRIVE DESCRIPTION Connect to GND for normal operation Power-on reset Crystal connection 1 (12MHz) Crystal connection 2 (12MHz) Programmable output clock for external devices Voltage supply 3.3V0.3V Device is in suspended state Connect to microcontroller interrupt I2C bi-directional data I2C bit-clock Ground reference USB D+ connection USB D- connection Analog ground reference Analog voltage supply 3.3V0.3V USB VBUS sensing pin NOTES: 1. Signals ending in _N indicate active LOW signals. ST: Schmitt Trigger OD6: Open Drain with 6 mA drive AI/O: Analog I/O APPLICATION DIAGRAM 3.3V USB Upstream 12 MHz CLKOUT I2C D11 C FUNCTIONAL BLOCK e.g. Monitor Control, Mouse, Keyboard, ... SV00824 1999 Jul 22 4 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 I2C Interface The I2C bus is used to interface to an external microcontroller needed to control the operation of the USB device. For cost consideration, the target system microcontroller can be shared and utilized for both the functional part as well as the USB protocol interfacing. The PDIUSBD11 implements a slave I2C interface. When the PDIUSBD11 needs to communicate with the microcontroller it asserts an interrupt signal. The microcontroller services this interrupt by reading the appropriate status register on the PDIUSBD11 through the I2C bus. (For more information about the I2C serial bus, refer to the I 2C Handbook, Philips order number 9397 750 00013). The I2C interface on the PDIUSBD11 defines two types of transactions: Protocol An I2C transaction starts with a Start Condition, followed by an address. When the address matches either the command or data address the transaction starts and runs until a Stop Condition or another Start Condition (repeated start) occurs. The command address is write-only and is unable to do a read. The next bytes in the message are interpreted as commands. Several command bytes can be sent after one command address. Each of the command bytes is acknowledged and passed on to the Memory Management Unit inside the PDIUSBD11. When the Start Condition address matches the data address, the next bytes are interpreted as data. When the RW bit in the address indicates a master writes data to slave (=`0') the bytes are received, acknowledged and passed on to the Memory Management Unit. If the RW bit in the address indicates a master reads data from slave (=`1') the PDIUSBD11 will send data to the master. The I2C-master must acknowledge all data bytes except the last one. In this way the I2C interface knows when the last byte has been transmitted and it then releases the SDA line so that the master controller can generate the Stop Condition. Repeated start support allows another packet to be sent without generating a Stop Condition. * command transaction - A command transaction is used to define which data (e.g., status byte, buffer data, ...) will be read from/written to the USB interface in the next data transaction. A data transaction usually follows a command transaction. - A data transaction reads data from/writes data to the USB interface. The meaning of the data is dependent on the command transaction which was sent before the data transaction. * data transaction Two addresses are used to differentiate between command and data transactions. Writing to the command address is interpreted as a command, while reading from/writing to the data address is used to transfer data between the PDIUSBH11A and the controller. Timing The I2C interface in the PDIUSBD11 can support clock speeds up to 1 MHz. ADDRESS TABLE Type of Address Command Data Physical Address MSB to LSB (Binary) 0011 011 0011 010 1999 Jul 22 5 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 COMMAND SUMMARY Some commands have the same command code (e.g., Read Buffer and Write Buffer). In these cases, the direction of the Data Phase (read or write) indicates which command is executed. COMMAND NAME Initialization Commands Set Address/Enable Set Endpoint Enable Set Mode Data Flow Commands Read Interrupt Register Select Endpoint Control OUT Endpoint Control IN Endpoint Other Endpoints Read Last Transaction Status Control OUT Endpoint Control IN Endpoint Other Endpoints Read Endpoint Status Control OUT Endpoint Control IN Endpoint Other Endpoints Read Buffer Write Buffer Set Endpoint Status Set Endpoint Status Acknowledge Setup Clear Buffer Validate Buffer General Commands Send Resume Read Current Frame Number F6h F5h None Read 1 or 2 bytes Selected Endpoint Selected Endpoint Control OUT Endpoint Control IN Endpoint Other Endpoints Selected Endpoint Selected Endpoint Selected Endpoint F4h 00h 01h 00h+Endpoint Index 40h 41h 40h+Endpoint Index 80h 81h 80h+Endpoint Index F0h F0h 40h 41h 40h+Endpoint Index F1h F2h FAh Read 2 bytes Read 1 byte (optional) Read 1 byte (optional) Read 1 byte (optional) Read 1 byte Read 1 byte Read 1 byte Read 1 byte Read 1 byte Read 1 byte Read n bytes Write n bytes Write 1 byte Write 1 byte Write 1 byte None None None Function Function Function D1h D8h F3h Write 1 byte Write 1 byte Write 2 byte RECIPIENT CODING DATA PHASE 1999 Jul 22 6 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 COMMAND DESCRIPTIONS Command Procedure There are three basic types of commands: Initialization, Data Flow, and General commands. Respectively, these are used to initialize the function; for data flow between the function and the host; and some general commands. Set Mode Command Data : F3h : Write 2 bytes Initialization Commands Initialization commands are used during the enumeration process of the USB network. These commands are used to enable the function endpoints. They are also used to set the USB assigned address. The Set Mode command is followed by two data writes. The first byte contains the configuration byte values. The second byte is the clock division factor byte. Configuration Byte 7 1 6 X 5 X 4 0 3 1 2 1 1 0 0 1 POWER ON VALUE REMOTE WAKEUP NO LAZYCLOCK CLOCK RUNNING DEBUG MODE SoftConnectTM RESERVED; WRITE 0 FUTURE MODE Set Address / Enable Command Data : D1h, (Function) : Write 1 byte This command is used to set the USB assigned address and enable the function. SV00827 7 0 6 0 5 0 4 0 3 0 2 0 1 0 0 0 POWER ON VALUE ADDRESS ENABLE Remote Wakeup No LazyClock A `1' indicates that a remote wakeup feature is ON. Bus reset will set this bit to `1'. A `1' indicates that CLKOUT will not switch to LazyClock. A `0' indicates that the CLKOUT switches to LazyClock 1ms after the Suspend pin goes high. LazyClock frequency is 30KHz 40%. The programmed value will not be changed by a bus reset. A `1' indicates that the internal clocks and PLL are always running even during Suspend state. A `0' indicates that the internal clock, crystal oscillator and PLL are stopped whenever not needed. To meet the strict Suspend current requirement, this bit needs to be set to `0'. The programmed value will not be changed by a bus reset. A `1' indicates that all errors and "NAKing" are reported and a `0' indicates that only OK and babbling are reported. The programmed value will not be changed by a bus reset. A `1' indicates that the upstream pull-up resistor will be connected if VBUS is available. A `0' means that the upstream resistor will not be connected. The programmed value will not be changed by a bus reset. Write a `1'. SV00825 Address Enable The value written becomes the address. A `1' enables this function. Clock Running Set Endpoint Enable Command Data : D8h : Write 1 byte The generic endpoints can only be enabled when the function is enabled via the Set Address/Enable command. Debug Mode 7 X 6 X 5 X 4 X 3 X 2 X 1 0 0 X POWER ON VALUE RESERVED; WRITE 0 FUNCTION GENERIC ENDPOINTS RESERVED; WRITE 0 SoftConnectTM FutureMode SV00826 Function Generic Endpoint A value of `1' indicates the function generic endpoints are enabled. 1999 Jul 22 7 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 Clock Division Factor Byte 7 X 6 X 5 X 4 X 3 1 2 0 1 1 0 1 Interrupt Register Byte 2 7 X 6 0 5 X 4 X 3 X 2 X 1 0 0 0 POWER ON VALUE CLOCK DIVISION FACTOR RESERVED POWER ON VALUE ENDPOINT INDEX 8 ENDPOINT INDEX 9 RESERVED SV00828 BUS RESET RESERVED Clock Division Factor The value indicates clock division factor for CLKOUT. The output frequency is 48 MHz/(N+1) where N is the Clock Division Factor. The reset value is 11. This will produce the output frequency of 4 MHz which can then be programmed up (or down) by the user. The minimum value is one giving the range of frequency from 4 to 24 MHz. The PDIUSBD11 design ensures no glitching during frequency change. The programmed value will not be changed by a bus reset. SV00830 Select Endpoint Command Data : 00-0Dh : Optional Read 1 byte The Select Endpoint command initializes an internal pointer to the start of the Selected buffer. Optionally, this command can be followed by a data read, which returns `0' if the buffer is empty and `1' if the buffer is full. 7 X 6 X 5 X 4 X 3 X 2 X 1 X 0 0 Data Flow Commands Data flow commands are used to manage the data transmission between the USB endpoints and the monitor. Much of the data flow is initiated via an interrupt to the microcontroller. The microcontroller utilizes these commands to access and determine whether the endpoint FIFOs have valid data. POWER ON VALUE FULL/EMPTY RESERVED Read Interrupt Register Full/Empty Command Data : F4h : Read 2 bytes SV00831 A `1' indicates the buffer is full, `0' indicates an empty buffer. Interrupt Register Byte 1 7 0 6 0 5 0 4 0 3 0 2 0 1 X 0 X POWER ON VALUE RESERVED CONTROL OUT ENDPOINT CONTROL IN ENDPOINT ENDPOINT INDEX 4 ENDPOINT INDEX 5 ENDPOINT INDEX 6 ENDPOINT INDEX 7 SV00829 This command indicates the origin of an interrupt. A `1' indicates an interrupt occurred at this endpoint. The bits are cleared by reading the endpoint status register through the Read Endpoint Status command. After a bus reset, an interrupt will be generated and bit 6 of the Interrupt Register Byte 2 will be `1'. The interrupt is internally cleared by reading the interrupt register. A bus reset is completely identical to the hardware reset through the RESET_N pin with the sole difference of interrupt notification. 1999 Jul 22 8 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 Read Last Transaction Status Command Data : 40-4Dh : Read 1 byte Read Endpoint Status Command Data : 80-8Dh : Read 1 byte The Read Last Transaction Status command is followed by one data read that returns the status of the last transaction of the endpoint. This command also resets the corresponding interrupt flag in the interrupt register, and clears the status, indicating that it was read. This command is useful for debugging purposes. Since it keeps track of every transaction, the status information is overwritten for each new transaction. 7 0 6 0 5 0 4 0 3 0 2 0 1 0 0 0 POWER ON VALUE DATA RECEIVE/TRANSMIT SUCCESS ERROR CODE (SEE TABLE) SETUP PACKET DATA 0/1 PACKET PREVIOUS STATUS NOT READ SV00832 7 X 6 X 5 0 4 0 3 0 2 0 1 X 0 X POWER ON VALUE RESERVED SETUP PACKET STALL DATA 0/1 PACKET BUFFER FULL RESERVED SV00833 Setup Packet STALL Data 0/1 Packet Buffer Full A `1' indicates the last received packet had a SETUP token. A `1' indicates the endpoint is stalled. A `1' indicates if the last received or sent packet had a DATA1 PID. A `1' indicates that the buffer is full. Data Receive/ Transmit Success Error Code Setup Packet A `1' indicates data has been received or transmitted successfully. See Table 1, Error Codes. A `1' indicates the last successful received packet had a SETUP token (this will always read `0' for IN buffers). A `1' indicates the last successful received or sent packet had a DATA1 PID. A `1' indicates a second event occurred before the previous status was read. Read Buffer Command Data : F0h : Read multiple bytes (max 10) Data 0/1 Packet The Read Buffer command is followed by a number of data reads, which return the contents of the selected endpoint data buffer. After each read, the internal buffer pointer is incremented by 1. The buffer pointer is not reset to the buffer start by the Read Buffer command. This means that reading or writing a buffer can be interrupted by any other command (except for Select Endpoint), or can be done by more than one I2C transaction (read the first 2 bytes to get the number of data bytes, then read the rest in other transactions). The data in the buffer are organized as follows: Previous Status not Read Table 1. ERROR CODES ERROR CODE 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1101 1111 No Error PID encoding Error; bits 7-4 are not the inversion of bits 3-0 PID unknown; encoding is valid, but PID does not exist Unexpected packet; packet is not of the type expected (= token, data or acknowledge), or SETUP token to a non-control endpoint Token CRC Error Data CRC Error Time Out Error Babble Error Unexpected End-of-packet Sent or received NAK Sent Stall, a token was received, but the endpoint was stalled Overflow Error, the received packet was longer than the available buffer space Bitstuff Error Wrong DATA PID; the received DATA PID was not the expected one RESULT * byte 0: * byte 1: * byte 2: * byte 3: Reserved: can have any value Number/length of data bytes Data byte 1 Data byte 2 ...... Write Buffer Command Data : F0h : Write multiple bytes (max 10) The Write Buffer command is followed by a number of data writes, which load the endpoints buffer. The data must be organized in the same way as described in the Read Buffer command. The first byte (reserved) should always be `0'. As in the Read Buffer command, the data can be split up into different I2C data transactions. WARNING: There is no protection against writing or reading over a buffer's boundary or against writing into an OUT buffer or reading from an IN buffer. Any of these actions could cause an incorrect operation. Data in an OUT buffer are only meaningful after a successful transaction. 1999 Jul 22 9 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 Clear Buffer Command Data : F2h : None Acknowledge Setup Command Data : F1h : None When a packet is received completely, an internal endpoint buffer full flag is set. All subsequent packets will be refused by returning a NAK. When the microcontroller has read the data, it should free the buffer by the Clear Buffer command. When the buffer is cleared, new packets will be accepted. The arrival of a SETUP packet flushes the IN buffer and disables the Validate Buffer and Clear Buffer commands for both IN and OUT endpoints. The microcontroller needs to re-enable these commands by the Acknowledge Setup command. This ensures that the last SETUP packet stays in the buffer and no packet can be sent back to the host until the microcontroller has acknowledged explicitly that it has seen the SETUP packet. The microcontroller must send the Acknowledge Setup command to both the IN and OUT endpoints. Validate Buffer Command Data : FAh : None When the microprocessor has written data into an IN buffer, it should set the buffer full flag by the Validate Buffer command. This indicates that the data in the buffer are valid and can be sent to the host when the next IN token is received. GENERAL COMMANDS Send Resume Set Endpoint Status Command Data : 40-4Dh : Write 1 byte Command Data : F6h : None A stalled control endpoint is automatically unstalled when it receives a SETUP token, regardless of the content of the packet. If the endpoint should stay in its stalled state, the microcontroller can re-stall it. When a stalled endpoint is unstalled (either by the Set Endpoint Status command or by receiving a SETUP token), it is also re-initialized. This flushes the buffer and if it is an OUT buffer it waits for a DATA 0 PID, if it is an IN buffer it writes a DATA 0 PID. Even when unstalled, writing Set Endpoint Status to `0' initializes the endpoint. Sends an upstream resume signal for 10 ms. This command is normally issued when the device is in suspend. The RESUME command is not followed by a data read or write. Read Current Frame Number Command Data : F5h : Read One or Two Bytes This command is followed by one or two data reads and returns the frame number of the last successfully received SOF. The frame number is returned Least Significant Byte first. 7 X 6 X 5 X 4 X 3 X 2 X 1 X 0 0 POWER ON VALUE STALLED RESERVED 7 X 6 X 5 X 4 X 3 X 2 X 1 X 0 X LEAST SIGNIFICANT BYTE 7 X 6 X 5 X 4 X 3 X 2 X 1 X 0 X MOST SIGNIFICANT BYTE SV00834 SV00835 Stalled A `1' indicates the endpoint is stalled. 1999 Jul 22 10 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VI/O VAI/O VO Tamb PARAMETER DC supply voltage DC input voltage range DC input voltage range for I/O DC input voltage range for analog I/O DC output voltage range Operating ambient temperature range in free air See DC and AC characteristics per device TEST CONDITIONS MIN 3.0 0 0 0 0 -40 MAX 3.6 5.5 5.5 VCC VCC 85 UNIT V V V V V C ABSOLUTE MAXIMUM RATINGS1 SYMBOL VCC IIK VI VI/O IOK VO IO IO IGND, ICC TSTG PTOT PARAMETER DC supply voltage DC input diode current DC input voltage DC input voltage range for I/O DC output diode current DC output voltage DC output sink or source current for other pins DC output sink or source current for D+/D- pins DC VCC or GND current Storage temperature range Power dissipation per package -60 VO > VCC or VO < 0 Note 2 VO = 0 to VCC VO = 0 to VCC -0.5 VI < 0 Note 2 -0.5 -0.5 TEST CONDITIONS MIN -0.5 MAX +4.6 -50 +5.5 VCC + 0.5 50 VCC + 0.5 15 50 100 +150 UNIT V mA V V mA V mA mA mA C NOTES: 1. Stresses beyond those listed may cause damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those listed in the RECOMMENDED OPERATING CONDITIONS table is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. DC CHARACTERISTICS (Digital pins) SYMBOL Input Levels VIL VIH PARAMETER LOW level input voltage HIGH level input voltage LOW to HIGH threshold voltage HIGH to LOW threshold voltage Hysteresis voltage TEST CONDITIONS MIN TYP MAX 0.6 UNIT V V V V V V V V V 2.7 ST (Schmitt Trigger) pins ST pins ST pins IOL = rated drive IOL = 20 A IOH = rated drive IOH = 20 A OD (Open Drain) pins Oscillator stopped & inputs to GND/VCC I2C operating 10 2.4 VCC - 0.1 5 5 15 1.4 0.9 0.4 1.9 1.5 0.7 0.4 0.1 VTLH VTHL VHYS Output Levels VO OL VO OH LOW level output voltage HIGH level output voltage Leakage Current IOZ IL IS IO OFF state current Input leakage current Suspend current Operating current A A A mA 1999 Jul 22 11 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 DC CHARACTERISTICS (AI/O pins) SYMBOL Leakage Current ILO Input Levels VDI VCM VSE VOL VOH Capacitance CIN ZDRV2 ZPU ZPD Transceiver capacitance Driver output resistance Pull-up resistance Pull-down resistance Pin to GND Steady state drive SoftConnectTM = ON Pull-down = ON 29 1.1 11 20 44 1.9 19 pF W kW kW Output Resistance Integrated Resistance Differential input sensitivity Differential common mode range Single-ended receiver threshold Static output LOW Static output HIGH RL of 1.5kW to 3.6V RL of 15kW to GND 2.8 |(D+) - (D-)|1 Includes VDI range 0.2 0.8 0.8 2.5 2.0 0.3 3.6 V V V V V Hi-Z state data line leakage 0V < VIN < 3.3V 10 A PARAMETER TEST CONDITIONS MIN MAX UNIT Output Levels NOTES: 1. D+ is the symbol for the USB positive data pin: DP. D- is the symbol for the USB negative data pin: DM. 2. Includes external resistors of 22 W 1% each on D+ and D-. LOAD FOR D+/D- UPSTREAM: 1.5kW IS INTERNAL VCC TEST POINT 1.5kW* 22W D. U. T. 15kW CL S1 TEST CL = 50pF, FULL SPEED CL = 50PF, LOW SPEED (MIN TIMING) CL = 350PF, LOW SPEED (MAX TIMING) * 1.5kW ON D- (LOW SPEED) OR D+ (FULL SPEED) ONLY D-/LS D+/LS D-/FS D+/FS S1 CLOSE OPEN OPEN CLOSE SV00836 1999 Jul 22 12 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 AC CHARACTERISTICS (AI/O pins, FULL speed) SYMBOL Driver characteristics Transition Time: Rise time Fall time Rise/fall time matching Output signal crossover voltage Source EOP width Differential data to EOP transition skew Receiver Data Jitter Tolerance To next transition For paired transitions EOP Width at Receiver Must reject as EOP Must accept Figure 1 Figure 1 PARAMETER TEST CONDITIONS CL = 50 pF; Rpu = 1.5 kW on D+ to VCC 4 4 90 1.3 160 -2 20 20 110 2.0 175 5 ns ns % V ns ns MIN MAX UNIT tr tf tRFM VCRS Driver Timings tEOPT tDEOP Between 10% and 90% (tr/tf) Receiver Timings tJR1 tJR2 tEOPR1 tEOPR2 Characterized and not tested. Guaranteed by design. G t db d i Figure 1 -18.5 -9 40 82 18.5 9 ns ns ns ns tPERIOD CROSSOVER POINT EXTENDED CROSSOVER POINT DIFFERENTIAL DATA LINES SOURCE EOP WIDTH: tEOPT DIFFERENTIAL DATA TO SEO/EOP SKEW N * tPERIOD + tDEOP RECEIVER EOP WIDTH: tEOPR1, tEOPR2 SV00837 Figure 1. Differential data to EOP transition skew and EOP width 1999 Jul 22 13 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 AC CHARACTERISTICS (I2C pins) All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and VIH with an input voltage swing of VSS and VDD. SYMBOL FSCL tBUF tSU;STA tHD;STA tLOW tHIGH tr tf tSU;DAT tHD;DAT tVD;DAT tSU;STO SCL clock frequency Bus free time Start condition set-up time Start condition hold time SCL LOW time SCL HIGH time SCL and SDA rise time SCL and SDA fall time Data set-up time Data hold time SCL LOW to data out valid Stop condition set-up time I2C-bus 0.25 100 0 0.4 0.5 0.25 0.25 0.45 0.45 0.3 0.1 PARAMETER TEST CONDITIONS MIN MAX 1000 UNIT kHz ms ms ms ms ms ms ms ns ns ms ms A detailed description of the specification, with applications, is given in the brochure "The be ordered using the Philips order number 9398 393 40011. I 2C-bus and how to use it". This brochure may PROTOCOL START CONDITION (S) BIT 7 MSB (A7) BIT 6 (A6) BIT 0 LSB (R/W) ACKNOWLEDGE (A) STOP CONDITION (P) tSU;STA tLOW tHIGH 1/fSCL SCL tBUF tr tf SDA tHD;STA tSU;DAT tHD;DAT tVD:DAT tSU;STO SV00756 Figure 2. I2C-bus timing diagram 1999 Jul 22 14 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 1999 Jul 22 15 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 1999 Jul 22 16 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations, reflow soldering is often used. WAVE SOLDERING Conventional single-wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems, the double-wave soldering method was specifically developed. If wave soldering is used, the following conditions must be observed for optimal results: with high upward pressure followed by a smooth laminar wave. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. * Use a double-wave soldering method comprising a turbulent wave * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement, and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive has cured. Typical dwell time is 4 seconds at 250C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. * For packages with leads on four sides, the footprint must be MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300C, it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400C, contact may be made for up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor-type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds, depending on heating method. Typical reflow peak temperatures range from 215 250C. The top-surface temperature of the packages should preferably be kept below 230C. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low-voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320C. 1999 Jul 22 17 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 SUITABILITY OF IC PACKAGES FOR WAVE, REFLOW AND DIPPING SOLDERING METHODS Soldering Method Mounting Mo nting Through-hole mount Package DBS, DIP, HDIP, SDIP, SIL BGA, SQFP, HLQFP, HSQFP, HSOP, SMS Surface mount PLCC, SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Wave suitable 2 not suitable not suitable 3 Reflow 1 - suitable suitable suitable suitable suitable Dipping suitable - - - - - suitable not recommended 4, 5 not recommended 6 NOTES: 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so-called "popcorn" effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) cannot be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP, and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pith (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Jul 22 18 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 NOTES 1999 Jul 22 19 Philips Semiconductors Product specification USB device with serial interface PDIUSBD11 Data sheet status Data sheet status Objective specification Preliminary specification Product specification Product status Development Qualification Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Production [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Date of release: 07-99 Document order number: 9397-750-06219 Philips Semiconductors 1999 Jul 22 20 |
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